Description - For most people the reflow process is like a black box where the Printed Circuit Board goes in, and it comes out with soldered connections. The reflow profile is a critical aspect of the soldering process. It defines the temperature and time settings that a PCB goes through in a reflow oven. The IPC standard IPC-7030 give guidelines for temperature profiling in reflow soldering. These are practical guidelines to meet requirements to produce acceptable solder joints.

This webinar gives useful information for developing a reflow profile.  As the process window narrows in lead-free soldering, profiling equipment and/or thermocouple (TC) errors must be taken into consideration. In addition, the accuracy and attachment method of the thermocouple will significantly impact critical assemblies. A thermal profile is used to for process control. It records the critical parameters of the reflow process.

Apart from making a thermal profile of your “Golden Board” there are other methods to verify the process conditions. The latest dataloggers, shuttles, do not only contain temperature and time measurements, but also have atmosphere (Oxygen measurement in Nitrogen ovens), conveyor vibration, and vacuum pressure sensors. For continuous process control there are Process Guard or Reflow Process Inspection options available. This technology gives full profile traceability. It records all data for every single board that runs through the reflow oven. Many different solutions for you to give you a better process control of what happens in that black box in the SMD line.

Presenter bio - Gerjan Diepstraten

Advanced Technology Manager at Vitronics Soltec, an ITW company. Responsible for soldering processes and new technology developments with over 30 years’ experience. Six Sigma Black Belt trained at University of Amsterdam. Learned about solder materials when working for Cobar Europe B.V. Received a 'Honorable Mention’ for IPC Technical Conference Paper presented at APEX Expo, Las Vegas 2009.
Published over 50 articles in technical magazines and is an IPC-A-610 Certified Trainer.  Presented technical research papers of over the world and owns several worldwide patents for soldering applications.

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Nov. 14 @ 11:00am EST - Click here to register