MPM Printers Features

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Edison Stencil Printer

Advanced Print Head

 

Single axis closed-loop pressure control for dual squeegee eliminates front-to-back variation; a single high precision load cell provides squeegee force, and a unique algorithm calibrates out non-linearity, maintaining the set pressure across the entire board surface.

Board Staging

Ability to have three boards in the machine simultaneously, reduced distance on input conveyor by pre-loading the board during the print process results in reduced transfer times and improved cycle time.

EdgeLoc Board Clamping System

The EdgeLoc system uses a side snugging technique that removes the need for top clamps which interfere with the PCB to stencil contact. The result is optimal gasketing and more volumetrically consistent edge-to-edge prints. With EdgeLoc II, robust flippers engage to secure the board across the top edge ensuring board flatness then move out of the way once the board is firmly gripped from the side. EdgeLoc+ board clamping can change between edge and top clamping simply through software.

High Speed Vision Alignment with Ultra-slim Camera

 

Overall gantry thickness is only 39 mm.  High speed vision uses an on the fly Power Over Ethernet (POE) camera.  A single CCD split field provides precision simultaneous updown image acquisition. Field of Vision (FOV) 9.7 x 6.0 mm.

OpenApps Architecture

 

MPM’s OpenApps is an open architecture source code which provides the capability of developing custom interfaces in support of Industry 4.0 initiatives and communication with Manufacturing Execution Systems (MES). ITW EAE is the first SMT company to offer open software architecture.

Intueri GUI and OpenApps

 

MPM Intueri is a simple, intuitive operator interface with a flexible, wide array of configuration variables. It is combined with Open Apps for maximum capability and connectivity and provides a portal to Industry 4.0 concepts.

Paste Height Monitor

The Paste Height Monitor is designed to prevent defects caused y inadequate volumes of paste on the stencil. It combines advanced software and sensor technology to accurately monitor the paste bead for volume consistency. Upper and lower limit roll-height monitoring eliminates insufficient or excess paste volumes. It is a non-contact solution that can automatically add more paste to the stencil as it is needed.

PrinTrack

 

PrinTrack™ adds traceability, data harvesting and reporting to your printing process. It can seamlessly integrate with other equipment and elements in the manufacturing cycle, such as MES and ERP, and can be expanded factory-wide.

SPI Print Optimizer

SPI Print Optimizer brings your Solder Paste Inspection (SPI) machine into communication with your MPM printer through a specially-developed common interface. When the SPI machine ‘sees’ X, Y and theta offset problems on a just-printed PCB, it analyzes the data virtually instantly 
and gives the printer instructions to correct those offsets, automatically, and ‘on the fly’.

Unparalleled Throughput and Speed

 

The Edison printer delivers an impressive 2X throughputcompared to competitive printers: 15 seconds total throughput - including stencil wipe cycle. 

That’s due in part to an all new highly-efficient parallel processing stencil shuttle system, wiper, vision gantry, and other cycle time reduction and innovations so that Edison delivers double the throughput of best-in-class printers worldwide.

Unprecendented Access and Back to Back (BTB) Configurable

 

The Edison recessed front design provides unprecedented access to tooling for easier service without reaching, bending, or fatigue. Edison can also be configured Back-to-Back for a flexible dual lane solution without adding line length.

Ultra-fast, High Efficiency Wiping System

 

The super-size 65mm roll lets you make 10,000 prints between change-outs, (for example, with a five-print frequency) - for less downtime. The system also features a uniqur Contamination Control Design.

Momentum II 100 Stencil Printer

AccuCheck Print Capability Verification

AccuCheck Print Capability Verification allows the printer to measure its own print capability. Users can verify the machine’s capability at any time or continuously on their own products. AccuCheck measures the actual print deposit position versus the target pad to determine a measured print offset. It is an inexpensive, reliable method of obtaining machine quality and process capability information to ensure repeatable results and optimum printing performance.

Automatic Paste Dispensing System

Dispense for standard cartridges or choose the new patent-pending jar dispenser. Paste is released in precise, measured amounts across the stencil in a clean, uniform bead. Deposition volumes, frequency and placement are user programmable.

Benchmark User Interface

Easy to learn and use for the average operator, MPM’s Benchmark software is powerful yet intuitive, and facilitates rapid setup, assists with operational tasks, and makes changeover quick and easy. The software has been upgraded to Windows 10 and new production tools and new Quickstart programming to make it even easier to use.

BridgeVision System

 

The BridgeVision™ system is a patented method of analyzing bridge defects on circuit boards during the post-print inspection process.

This innovative system uses  texture-based image acquisition algorithms and a digital camera system with telecentric lenses to support the accurate identification of paste deposit defects.

  • Finds bridging defects post-print – before they go to reflow
  • Patented contrast and texture-based technologies
  • Combines with SPC tools

The BridgeVision system operates simultaneously with the MPM 2D paste inspection system.

MPM Vision System & Inspection

MPM’s patented printe rbased Vision and Inspection system is a cost-effective way to verify print and paste deposit results. It is flexible enough to handle the complete range of today’s most challenging components. This system measures the amount of paste covering the target pad and compares it with the required coverage. 2D inspection is integrated directly into the stencil printer to provide an immediate source of data.

OpenApps Architecture

 

MPM’s OpenApps is an open architecture source code which provides the capability of developing custom interfaces in support of Industry 4.0 initiatives and communication with Manufacturing Execution Systems (MES). ITW EAE is the first SMT company to offer open software architecture.

Paste Height Monitor

The Paste Height Monitor is designed to prevent defects caused y inadequate volumes of paste on the stencil. It combines advanced software and sensor technology to accurately monitor the paste bead for volume consistency. Upper and lower limit roll-height monitoring eliminates insufficient or excess paste volumes. It is a non-contact solution that can automatically add more paste to the stencil as it is needed.

Paste Temperature Monitor

Temperature monitoring ensures proper paste viscosity to avoid bridging and voiding. MPM patent- pending paste temperature monitor allows paste to be measured in the cartridge or on the stencil.

PrinTrack

 

PrinTrack™ adds traceability, data harvesting and reporting to your printing process. It can seamlessly integrate with other equipment and elements in the manufacturing cycle, such as MES and ERP, and can be expanded factory-wide.

RapidClean Stencil Cleaner

RapidClean is a high speed stencil solvent cleaning innovation that slashes cycle time and improves stencil cleaning performance, especially for fine-pitch. RapidClean reduces 3 wipe strokes to 2 and cuts cycle time by 5 – 6 seconds per print cycle over the standard wiper; and because fewer cleaning cycles are required, RapidClean can save up to $10K USD per annum in paper savings per printer.

StencilVision System

 

The StencilVision™ system uses texture-based technology and a digital camera system to check the underside of a stencil for solder paste contamination. The results of the check drive wiper operation.

The StencilVision system:

  • Detects solder paste seepage from apertures to stencil underside
  • Initiates underside stencil wiping sequence to remove contamination
  • Prevents print defects, contamination of PCB caused by dirty stencil underside
  • Efficient – initiates wiping only when needed

Ensures optimum stencil to board gasketing

SPI Print Optimizer

SPI Print Optimizer brings your Solder Paste Inspection (SPI) machine into communication with your MPM printer through a specially-developed common interface. When the SPI machine ‘sees’ X, Y and theta offset problems on a just-printed PCB, it analyzes the data virtually instantly 
and gives the printer instructions to correct those offsets, automatically, and ‘on the fly’.

Momentum II BTB Stencil Printer

AccuCheck Print Capability Verification

AccuCheck Print Capability Verification allows the printer to measure its own print capability. Users can verify the machine’s capability at any time or continuously on their own products. AccuCheck measures the actual print deposit position versus the target pad to determine a measured print offset. It is an inexpensive, reliable method of obtaining machine quality and process capability information to ensure repeatable results and optimum printing performance.

Automatic Paste Dispensing System

Dispense for standard cartridges or choose the new patent-pending jar dispenser. Paste is released in precise, measured amounts across the stencil in a clean, uniform bead. Deposition volumes, frequency and placement are user programmable.

Benchmark User Interface

Easy to learn and use for the average operator, MPM’s Benchmark software is powerful yet intuitive, and facilitates rapid setup, assists with operational tasks, and makes changeover quick and easy. The software has been upgraded to Windows 10 and new production tools and new Quickstart programming to make it even easier to use.

BridgeVision System

 

The BridgeVision™ system is a patented method of analyzing bridge defects on circuit boards during the post-print inspection process.

This innovative system uses  texture-based image acquisition algorithms and a digital camera system with telecentric lenses to support the accurate identification of paste deposit defects.

  • Finds bridging defects post-print – before they go to reflow
  • Patented contrast and texture-based technologies
  • Combines with SPC tools

The BridgeVision system operates simultaneously with the MPM 2D paste inspection system.

EdgeLoc Board Clamping System

The EdgeLoc system uses a side snugging technique that removes the need for top clamps which interfere with the PCB to stencil contact. The result is optimal gasketing and more volumetrically consistent edge-to-edge prints. With EdgeLoc II, robust flippers engage to secure the board across the top edge ensuring board flatness then move out of the way once the board is firmly gripped from the side. EdgeLoc+ board clamping can change between edge and top clamping simply through software.

EnclosedFlow Print Head

The MPM EnclosedFlow Print Head delivers uniform aperture filling and superb printing performance especially for fine pitch devices, with tremendous savings on solder paste over squeegee blade printing – in excess of 50% over blades for dramatically fast ROI. Printing fine features such as 01005s and 0.3mm pitch CSPs with up to 50% greater volume and 25% lower deviation than metal blades.

OpenApps Architecture

 

MPM’s OpenApps is an open architecture source code which provides the capability of developing custom interfaces in support of Industry 4.0 initiatives and communication with Manufacturing Execution Systems (MES). ITW EAE is the first SMT company to offer open software architecture.

MPM Vision System & Inspection

MPM’s patented printe rbased Vision and Inspection system is a cost-effective way to verify print and paste deposit results. It is flexible enough to handle the complete range of today’s most challenging components. This system measures the amount of paste covering the target pad and compares it with the required coverage. 2D inspection is integrated directly into the stencil printer to provide an immediate source of data.

Paste Height Monitor

The Paste Height Monitor is designed to prevent defects caused y inadequate volumes of paste on the stencil. It combines advanced software and sensor technology to accurately monitor the paste bead for volume consistency. Upper and lower limit roll-height monitoring eliminates insufficient or excess paste volumes. It is a non-contact solution that can automatically add more paste to the stencil as it is needed.

Paste Temperature Monitor

Temperature monitoring ensures proper paste viscosity to avoid bridging and voiding. MPM patent- pending paste temperature monitor allows paste to be measured in the cartridge or on the stencil.

PrinTrack

 

PrinTrack™ adds traceability, data harvesting and reporting to your printing process. It can seamlessly integrate with other equipment and elements in the manufacturing cycle, such as MES and ERP, and can be expanded factory-wide.

RapidClean Stencil Cleaner

RapidClean is a high speed stencil solvent cleaning innovation that slashes cycle time and improves stencil cleaning performance, especially for fine-pitch. RapidClean reduces 3 wipe strokes to 2 and cuts cycle time by 5 – 6 seconds per print cycle over the standard wiper; and because fewer cleaning cycles are required, RapidClean can save up to $10K USD per annum in paper savings per printer.

SPI Print Optimizer

SPI Print Optimizer brings your Solder Paste Inspection (SPI) machine into communication with your MPM printer through a specially-developed common interface. When the SPI machine ‘sees’ X, Y and theta offset problems on a just-printed PCB, it analyzes the data virtually instantly 
and gives the printer instructions to correct those offsets, automatically, and ‘on the fly’.

StencilVision System

 

The StencilVision™ system uses texture-based technology and a digital camera system to check the underside of a stencil for solder paste contamination. The results of the check drive wiper operation.

The StencilVision system:

  • Detects solder paste seepage from apertures to stencil underside
  • Initiates underside stencil wiping sequence to remove contamination
  • Prevents print defects, contamination of PCB caused by dirty stencil underside
  • Efficient – initiates wiping only when needed

Ensures optimum stencil to board gasketing

Momentum II Elite Stencil Printer

AccuCheck Print Capability Verification

AccuCheck Print Capability Verification allows the printer to measure its own print capability. Users can verify the machine’s capability at any time or continuously on their own products. AccuCheck measures the actual print deposit position versus the target pad to determine a measured print offset. It is an inexpensive, reliable method of obtaining machine quality and process capability information to ensure repeatable results and optimum printing performance.

Automatic Paste Dispensing System

Dispense for standard cartridges or choose the new patent-pending jar dispenser. Paste is released in precise, measured amounts across the stencil in a clean, uniform bead. Deposition volumes, frequency and placement are user programmable.

Automatic Pin Placement

Automatic Pin Placement is a patented MPM tooling solution that uses the vision gantry to precisely place and remove pins. Pin patterns are software programmable and ensure quick, easy, and repeatable product changeover.

Benchmark User Interface

Easy to learn and use for the average operator, MPM’s Benchmark software is powerful yet intuitive, and facilitates rapid setup, assists with operational tasks, and makes changeover quick and easy. The software has been upgraded to Windows 10 and new production tools and new Quickstart programming to make it even easier to use.

BridgeVision System

 

The BridgeVision™ system is a patented method of analyzing bridge defects on circuit boards during the post-print inspection process.

This innovative system uses  texture-based image acquisition algorithms and a digital camera system with telecentric lenses to support the accurate identification of paste deposit defects.

  • Finds bridging defects post-print – before they go to reflow
  • Patented contrast and texture-based technologies
  • Combines with SPC tools

The BridgeVision system operates simultaneously with the MPM 2D paste inspection system.

Camalot Inside Integrated Dispensing System

Only ITW EAE, with industry-leading core competencies in printer AND dispenser technologies, can bring both together to the customer’s advantage. Camalot Inside consists of two dispense pumps integrated into one printing machine. Camalot Inside provides ultimate flexibility, allowing the dispensing of two different materials, or the same material (doubling dispense throughput speed) with two needle sizes to easily administer multiple dot sizes.

EdgeLoc Board Clamping System

The EdgeLoc system uses a side snugging technique that removes the need for top clamps which interfere with the PCB to stencil contact. The result is optimal gasketing and more volumetrically consistent edge-to-edge prints. With EdgeLoc II, robust flippers engage to secure the board across the top edge ensuring board flatness then move out of the way once the board is firmly gripped from the side. EdgeLoc+ board clamping can change between edge and top clamping simply through software.

EnclosedFlow Print Head

The MPM EnclosedFlow Print Head delivers uniform aperture filling and superb printing performance especially for fine pitch devices, with tremendous savings on solder paste over squeegee blade printing – in excess of 50% over blades for dramatically fast ROI. Printing fine features such as 01005s and 0.3mm pitch CSPs with up to 50% greater volume and 25% lower deviation than metal blades.

MPM Vision System & Inspection

MPM’s patented printe rbased Vision and Inspection system is a cost-effective way to verify print and paste deposit results. It is flexible enough to handle the complete range of today’s most challenging components. This system measures the amount of paste covering the target pad and compares it with the required coverage. 2D inspection is integrated directly into the stencil printer to provide an immediate source of data.

OpenApps Architecture

 

MPM’s OpenApps is an open architecture source code which provides the capability of developing custom interfaces in support of Industry 4.0 initiatives and communication with Manufacturing Execution Systems (MES). ITW EAE is the first SMT company to offer open software architecture.

Paste Temperature Monitor

Temperature monitoring ensures proper paste viscosity to avoid bridging and voiding. MPM patent- pending paste temperature monitor allows paste to be measured in the cartridge or on the stencil.

Paste Height Monitor

The Paste Height Monitor is designed to prevent defects caused y inadequate volumes of paste on the stencil. It combines advanced software and sensor technology to accurately monitor the paste bead for volume consistency. Upper and lower limit roll-height monitoring eliminates insufficient or excess paste volumes. It is a non-contact solution that can automatically add more paste to the stencil as it is needed.

PrinTrack

 

PrinTrack™ adds traceability, data harvesting and reporting to your printing process. It can seamlessly integrate with other equipment and elements in the manufacturing cycle, such as MES and ERP, and can be expanded factory-wide.

Quick Release Squeegee

New quick release squeegee blades make changing blades quick and easy with no tools required.  It takes less than 30 seconds to change the blade. 

RapidClean Stencil Cleaner

RapidClean is a high speed stencil solvent cleaning innovation that slashes cycle time and improves stencil cleaning performance, especially for fine-pitch. RapidClean reduces 3 wipe strokes to 2 and cuts cycle time by 5 – 6 seconds per print cycle over the standard wiper; and because fewer cleaning cycles are required, RapidClean can save up to $10K USD per annum in paper savings per printer.

RapidView Inspection

 

Built on our patented optics technology, the RapidView™ system delivers high-speed 2D inspection with device-level SPC reporting. RapidView™ inspection is up to three and half times faster than our standard system, can increase the Field of View (FOE) by 4x, and can work in conjunction with our GerberEZ Teach™ system.

SPI Print Optimizer

SPI Print Optimizer brings your Solder Paste Inspection (SPI) machine into communication with your MPM printer through a specially-developed common interface. When the SPI machine ‘sees’ X, Y and theta offset problems on a just-printed PCB, it analyzes the data virtually instantly 
and gives the printer instructions to correct those offsets, automatically, and ‘on the fly’.

StencilVision System

 

The StencilVision™ system uses texture-based technology and a digital camera system to check the underside of a stencil for solder paste contamination. The results of the check drive wiper operation.

The StencilVision system:

  • Detects solder paste seepage from apertures to stencil underside
  • Initiates underside stencil wiping sequence to remove contamination
  • Prevents print defects, contamination of PCB caused by dirty stencil underside
  • Efficient – initiates wiping only when needed

Ensures optimum stencil to board gasketing

Momentum II HiE Stencil Printer

AccuCheck Print Capability Verification

AccuCheck Print Capability Verification allows the printer to measure its own print capability. Users can verify the machine’s capability at any time or continuously on their own products. AccuCheck measures the actual print deposit position versus the target pad to determine a measured print offset. It is an inexpensive, reliable method of obtaining machine quality and process capability information to ensure repeatable results and optimum printing performance.

Automatic Paste Dispensing System

Dispense for standard cartridges or choose the new patent-pending jar dispenser. Paste is released in precise, measured amounts across the stencil in a clean, uniform bead. Deposition volumes, frequency and placement are user programmable.

Automatic Pin Placement

Automatic Pin Placement is a patented MPM tooling solution that uses the vision gantry to precisely place and remove pins. Pin patterns are software programmable and ensure quick, easy, and repeatable product changeover.

Benchmark User Interface

Easy to learn and use for the average operator, MPM’s Benchmark software is powerful yet intuitive, and facilitates rapid setup, assists with operational tasks, and makes changeover quick and easy. The software has been upgraded to Windows 10 and new production tools and new Quickstart programming to make it even easier to use.

BridgeVision System

 

The BridgeVision™ system is a patented method of analyzing bridge defects on circuit boards during the post-print inspection process.

This innovative system uses  texture-based image acquisition algorithms and a digital camera system with telecentric lenses to support the accurate identification of paste deposit defects.

  • Finds bridging defects post-print – before they go to reflow
  • Patented contrast and texture-based technologies
  • Combines with SPC tools

The BridgeVision system operates simultaneously with the MPM 2D paste inspection system.

Camalot Inside Integrated Dispensing System

Only ITW EAE, with industry-leading core competencies in printer AND dispenser technologies, can bring both together to the customer’s advantage. Camalot Inside consists of two dispense pumps integrated into one printing machine. Camalot Inside provides ultimate flexibility, allowing the dispensing of two different materials, or the same material (doubling dispense throughput speed) with two needle sizes to easily administer multiple dot sizes.

EdgeLoc Board Clamping System

The EdgeLoc system uses a side snugging technique that removes the need for top clamps which interfere with the PCB to stencil contact. The result is optimal gasketing and more volumetrically consistent edge-to-edge prints. With EdgeLoc II, robust flippers engage to secure the board across the top edge ensuring board flatness then move out of the way once the board is firmly gripped from the side. EdgeLoc+ board clamping can change between edge and top clamping simply through software.

EnclosedFlow Print Head

The MPM EnclosedFlow Print Head delivers uniform aperture filling and superb printing performance especially for fine pitch devices, with tremendous savings on solder paste over squeegee blade printing – in excess of 50% over blades for dramatically fast ROI. Printing fine features such as 01005s and 0.3mm pitch CSPs with up to 50% greater volume and 25% lower deviation than metal blades.

MPM Vision System & Inspection

MPM’s patented printe rbased Vision and Inspection system is a cost-effective way to verify print and paste deposit results. It is flexible enough to handle the complete range of today’s most challenging components. This system measures the amount of paste covering the target pad and compares it with the required coverage. 2D inspection is integrated directly into the stencil printer to provide an immediate source of data.

OpenApps Architecture

 

MPM’s OpenApps is an open architecture source code which provides the capability of developing custom interfaces in support of Industry 4.0 initiatives and communication with Manufacturing Execution Systems (MES). ITW EAE is the first SMT company to offer open software architecture.

Paste Height Monitor

The Paste Height Monitor is designed to prevent defects caused y inadequate volumes of paste on the stencil. It combines advanced software and sensor technology to accurately monitor the paste bead for volume consistency. Upper and lower limit roll-height monitoring eliminates insufficient or excess paste volumes. It is a non-contact solution that can automatically add more paste to the stencil as it is needed.

Paste Temperature Monitor

Temperature monitoring ensures proper paste viscosity to avoid bridging and voiding. MPM patent- pending paste temperature monitor allows paste to be measured in the cartridge or on the stencil.

PrinTrack

 

PrinTrack™ adds traceability, data harvesting and reporting to your printing process. It can seamlessly integrate with other equipment and elements in the manufacturing cycle, such as MES and ERP, and can be expanded factory-wide.

Quick Release Squeegee

New quick release squeegee blades make changing blades quick and easy with no tools required.  It takes less than 30 seconds to change the blade. 

RapidClean Stencil Cleaner

RapidClean is a high speed stencil solvent cleaning innovation that slashes cycle time and improves stencil cleaning performance, especially for fine-pitch. RapidClean reduces 3 wipe strokes to 2 and cuts cycle time by 5 – 6 seconds per print cycle over the standard wiper; and because fewer cleaning cycles are required, RapidClean can save up to $10K USD per annum in paper savings per printer.

RapidView Inspection

 

Built on our patented optics technology, the RapidView™ system delivers high-speed 2D inspection with device-level SPC reporting. RapidView™ inspection is up to three and half times faster than our standard system, can increase the Field of View (FOE) by 4x, and can work in conjunction with our GerberEZ Teach™ system.

SPI Print Optimizer

SPI Print Optimizer brings your Solder Paste Inspection (SPI) machine into communication with your MPM printer through a specially-developed common interface. When the SPI machine ‘sees’ X, Y and theta offset problems on a just-printed PCB, it analyzes the data virtually instantly 
and gives the printer instructions to correct those offsets, automatically, and ‘on the fly’.

StencilVision System

 

The StencilVision™ system uses texture-based technology and a digital camera system to check the underside of a stencil for solder paste contamination. The results of the check drive wiper operation.

The StencilVision system:

  • Detects solder paste seepage from apertures to stencil underside
  • Initiates underside stencil wiping sequence to remove contamination
  • Prevents print defects, contamination of PCB caused by dirty stencil underside
  • Efficient – initiates wiping only when needed

Ensures optimum stencil to board gasketing