Lead-free soldering

In the demanding environment of lead-free soldering, it is important to understand the different characteristics of lead-free materials. Wetting times for lead-free alloys are slower than those of tin/lead, and do not flow as easily. In order to solder in lead-free environments, solder temperatures may need to increase and nitrogen may be added to reduce wetting times. It is also imperative to increase the dwell time of the PCB in the solder because of the slower wetting times of lead-free alloys.

Electrovert has developed several technologies to meet the requirements of lead-free soldering:

UltraFill™ Nozzle technology (patented):

  • Improves soldering results with lead-free alloys;

  • Nozzle placement increases wave contact time;

  • Nozzles are placed closer together reducing temperature drop between the two waves;

  • Increases hole fill and topside fillets;

  • Reduced bridges or solder shorts with Lambda wave exit characteristics;

  • Easy switching between air and nitrogen atmospheres.

DwellMax™ Plus (patented):

  • Wide chip wave designed for thermally-challenging, difficult to solder type products (i.e., thick multi-layer and/or high thermal mass circuit boards, thick pallets, selective pallets) were achieving acceptable hole fill is the main challenge;

  • Includes nitrogen tunnel over solder pot;

  • Nozzle design increases production throughput capability;

  • Nozzle design reduces defect rate and improved topside hole fill at faster conveyor speeds;

  • Significant cost savings through reduced dross formation and extended intervals between maintenance.

  • Distance between nozzles are further reduced which reduces the temperature drop between the two waves thus improving topside hole fill.

FloLift™ Technology:

  • Increases upward force of wave as the PCB is traveling over the wave;

  • Improves topside hole fill;

  • Software and recipe controlled.

Nitrogen Tunnel:

  • Available with UltraFill nozzle;

  • Available in Short or Full Tunnel types

  • Significant cost savings through reduced dross formation;

  • Longer intervals between scheduled maintenance;

  • Improved wetting in nitrogen tunnel;

  • Available with an optional Oxygen analyzer;

  • Available as a field upgrade (check with the factory with serial # for configuration and compatibility verification).

Additional Advantages of Electrovert Wave Soldering:

  • All new wave systems come with a lifetime warranty on the solder pot casting (applies to original owner);

  • Multiple preheat technologies and configurations (IR, IR Platen, VectaHeat, and High Velocity Forced Convection).

  • Multiple fluxing technologies (ServoSpray, ServoJet, OA ServoJet, and ServoSonic)


Wave Soldering Machines:
DeltaX Wave Solder Electra Wave Solder 
VectraElite Wave Solder VectraES Wave Solder


As board assemblies become increasingly complex and difficult to solder, board manufacturers are looking for wave solder machines that can provide closed-loop process control and automatic features.

Of the many flux products developed for soldering applications, most electronics assemblers prefer to use no-clean, low solids formulations, in part because they eliminate the post-reflow cleaning or defluxing process step.

As PCB designs become more complex, thicker, and denser, through-hole soldering is becoming more difficult. The introduction of lead-free alloys compounds these problems because lead-free alloys don’t wet as well as lead-bearing alloys, and deeper holes (due to PCB thickness) make thorough hole-filling less certain in many cases.

As the complexity of PCB assemblies continues to increase, many electronics assemblers are seeking a solution in a wave soldering machine.

Award-winning wave soldering technologies have long met the demanding throughput and process control challenges of applications such as lead-free wave soldering.

Even though most SMT soldering is achieved through reflow, some assemblies require that some of the Surface Mounted Devices (SMDs) on a board, such as chip components, must be wave soldered.