Wave Soldering SMT

Even though most SMT soldering is achieved through reflow, some assemblies require that some of the Surface Mounted Devices (SMDs) on a board, such as chip components, must be wave soldered. Often, these passive components are on the bottom side of a PCB and are held in place by dots of adhesive. In many cases the top-side SMDs are then attached with a reflow oven pass. Much depends on the design of the product and the components used.

Electrovert® Electra™VectraElite™, and VectraES™ and Vitronics Soltec Delta X wave soldering equipment offers several features that increase process capability and flexibility, enabling wave soldering of SMDs.

  • Omega wave: Electrovert Omega wave features an oscillating vibration in the main wave that promotes wetting around small components.

  • Rotary chip wave: The rotary chip wave promotes wetting to pads and eliminates skips and shadowing caused by taller SMT components.  The feature includes a programmable rotary rpm to control the wave action.

  • Soldering in Nitrogen: The use of nitrogen improves wetting ability. This applies to both through-hole components and SMDs. Nitrogen soldering features include UltraFill™ boundary-type N2 soldering and a nitrogen tunnel (inerts the entire solder pot area).


Wave Soldering Machines:
DeltaX Wave Solder Electra Wave Solder 
VectraElite Wave Solder VectraES Wave Solder

As board assemblies become increasingly complex and difficult to solder, board manufacturers are looking for wave solder machines that can provide closed-loop process control and automatic features.

Of the many flux products developed for soldering applications, most electronics assemblers prefer to use no-clean, low solids formulations, in part because they eliminate the post-reflow cleaning or defluxing process step.

In the demanding environment of lead-free soldering, it is important to understand the different characteristics of lead-free materials. Wetting times for lead-free alloys are slower than those of tin/lead, and flow characteristic are more viscous.

As PCB designs become more complex, thicker, and denser, through-hole soldering is becoming more difficult. The introduction of lead-free alloys compounds these problems because lead-free alloys don’t wet as well as lead-bearing alloys, and deeper holes (due to PCB thickness) make thorough hole-filling less certain in many cases.

As the complexity of PCB assemblies continues to increase, many electronics assemblers are seeking a solution in a wave soldering machine.

Award-winning wave soldering technologies have long met the demanding throughput and process control challenges of applications such as lead-free wave soldering.