As the complexity of board assemblies continues to increase, board manufactures are looking for the best solution in a wave soldering system.  The solution must meet their soldering expectations for today and far into the future. 

The VectraES with it’s extensive list of features utilize technologies that provide complete process flexibility and process control.

Achieving the best solder joint quality, maximum topside hole fill, and zero defect soldering are requirements in all industries.  The VectraES features such as ServoJet™ fluxing, forced convection preheat, and UltraFill™ 4.0 and Chip 4.0 solder nozzles provide board assemblers the capability to process the most difficult soldering applications in the most demanding environments.

As the complexity of board assemblies continues to increase, board manufactures are looking for the best solution in a wave soldering system.  The solution must meet their soldering expectations for today as well as for the future.

The VectraES is designed to handle lead free applications for many years.  The cast iron solder pot and its components are resistant to the corrosive nature of lead-free solders and are capable of withstanding temperatures of 302° C (576° F).  All components that come into contact with the solder are titanium as standard.  Features such as our Quick Change Solder Pot provide the flexibility to easily change alloys in a safe and timely manner. 

Proven performance and reliability are key.  Electrovert holds the industry reputation as having the most reliable wave soldering that lasts the longest when compared to other brands.   Board assemblers know the value in owning an Electrovert wave soldering system.  The VectraES carries a lifetime warranty on the solder pot casting to the original owner (see the full explanation in terms and conditions).

The robust conveyor is designed to handle demanding production environments yet is easy to maintain.  Standard features such as automatic lead clearance adjustment allow complete process control.  A soldering process width of 457 mm (18 inches) is standard.

Electrovert’s UltraFill™ 4.0 and Chip 4.0 solder nozzles are designed to provide maximum top-side hole fill, provide the best hole fill quality, improve first pass yields, reduce dross , and promote easy maintenance. UltraFill 4.0 nozzle are ideal for soldering thick, high thermal mass circuit boards.

The VectraES is capable of up to 1.8 meters (6 feet) of bottom side preheat and up to 1.2 meters (4 feet) of topside preheat.  Multiple types of preheat are offered for complete process flexibility (High velocity forced convection and calrod IR type).  The optional quick plug feature allows plug and play preheat configurations that are easy to change.

As the complexity of board assemblies continues to increase, fluxing quality has become more of a focus to ensure soldering quality is achieved.  Electrovert is ahead of competitors and offer the best fluxing technologies available in the marketplace.  The ServoJet™ fluxing system provides the ultimate in precision deposition and hole penetration (OA version available for aggressive flux applications) while ServoSonic™ and ServoSpray™ fluxing systems are available for ultrasonic and value based solutions.  The VectraES is available with either foam or spray type fluxers.

Electrovert’s software and operation controls were designed with user interface in mind.  The Windows® operating system is multi-functional and easy to use.  The 3D GUI provides the user a real-time view of the complete machine modules, operation, and product being soldered.  All Electrovert systems have a customizable quick view screen that allows engineers and operators to view critical machine parameters that are important to the process or application.

Automation, defect reduction, repeatability, MES information management and simplified operation continue to be market drivers across all aspects of board assembly manufacturing. Electrovert’s patented Auto Exit Wing feature provides the level of automation that allows an automated adjustment of the laminar wave flow to match the board velocity for reduced defects. The recipe-controlled set-point ensures the wave dynamics are automatically adjusted ensuring wave flow dynamics are optimized for each PCB type and application.

Auto Exit Wing (English) - brochure

Auto Exit Wing (Chinese) - brochure

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The patented UltraFill 4.0 solder nozzle is an ideal solution for lead-free soldering. The UltraFill 4.0 nozzle is 40% wider than traditional tin-lead nozzle to increase contact time. The nozzle placement reduces the temperature drop between nozzles and improves hole fill. UltraFill allows either air or nitrogen operation through the same design without switching nozzles. Nitrogen or air operation can be selected through the desired recipe, without the need to change nozzles (also available with the rotary chip nozzle).

Electrovert’s short nitrogen tunnel feature utilizes patented technology that inerts at the solder wave area only.  This efficient approach maintains a very low oxygen environment of <50 ppm which is ideal for increased wetting effects and a significant reduction of dross.

Benefits of the short nitrogen tunnel feature includes:

• Available for use with UltraFill and rotary chip wave nozzles;
• Significant reduction in dross and maintenance in the solder module area with pay-back in less than 6 months (depending on application and alloy);
• Minimal distance between preheat and solder contact area;
• Inerted environment allows the use of milder fluxes and/or a reduced amount of flux applied;
• Optional O2 analyzer enables data logging of critical parameters specific to the solder wave area;
• Simple, efficient design provides easy access to solder module;

Electrovert’s full nitrogen tunnel with N2 injection technology feature offers complete process capability and flexibility for all nitrogen soldering applications. The full nitrogen tunnel feature is an efficient design that maintains a very low oxygen environment of <50 ppm which is ideal for increased wetting effects and a significant reduction of dross.

Benefits of the full nitrogen tunnel feature include:

• Available for use with UltraFill 4.0 and Chip 4.0 wave nozzles;
• Full N2 tunnel feature is compatible with forced convection and IR type preheats in any position and/or location;
• One single conveyor throughout the entire machine ensures a smooth product flow throughout the entire process and eliminates the concern of any additional maintenance that may be required due to split conveyor type systems;
• Significant reduction in dross and maintenance in the solder module area with pay-back in less than 6 months (depending on application and alloy);
• Minimal distance between preheat and solder contact area;
• Injected N2 into the preheat area expands process window, allows the use of milder fluxes and/or a reduced amount of flux applied;
• Optional O2 analyzer enables data logging of critical parameters specific to the solder wave area;
• Simple, efficient design provides easy access to preheaters and solder module

ExactaWave is a patented, high-reliability sensor with closed-loop feedback designed to control the solder wave height relative to the board. Its ability withstand temperatures up to 300° (573°F) makes it perfectly suited for precision soldering applications.

The ExactaWave system compensates for changes in solder level, dross accumulation and set-up changes made during maintenance. Thus, a set-point entered in a recipe always produces the same result. The ExactaWave’s seamless integration into the soldering machine’s software also allows it to operate in standby mode and is a parameter that can be data logged with trending capability.

The ServoJet system ensures thorough flux penetration by utilizing concentric air atomization.  It offers a programmable method of applying flux that results in consistent flux deposition and reduced flux usage.  The ServoJet utilizes air atomized multiple jet technology that is 100% integrated into the wave soldering system software.  [servojet]

High end fluxer capabilities include:

• Precision selective fluxing capability  that applies different flux volumes to individual sections of the board;
• OA version available for aggressive water soluble type fluxes;
• Optional Dual Flux capability;
• User-defined automatic self-clean;
• Field upgradable.

ServoJet benefits include:

• Accurate flux control that reduces bridging;
• Improved hole penetration;
• Reduced flux consumption;
• Precision selective fluxing (standard ServoJet version);
• Optional dual flux capability for recipe-dependant conversion to a second flux for quick product change-over;
• 100% integrated into machine software providing data logging and trending capability;
• Applies to a wide range of fluxes.

ServoSpray provides an ideal balance between system performance, functionality and low cost of ownership. ServoSpray has the ability to spray in one or both directions, includes self-clean capability, and features a pressure tank flux supply system. ServoSpray utilizes atomized air delivery technology and is 100% integrated into the wave solder machine software.

ServoSpray benefits include:

• Ability to spray in one or both directions;
• Improved top side hole penetration;
• Reduced flux consumption;
• Reduced maintenance costs;
• Selective flux capability;
• Optional dual flux capability for recipe-dependant conversion to a second flux for quick product change-over;
• 100% integrated into machine software providing data logging and trending capability;
• Applies to a wide range of fluxes.

The ServoSonic is a reciprocating ultrasonic atomizing spray fluxing system. It consists of an ultrasonic atomized spray nozzle and air impact nozzle with an automatic self-cleaning function. The titanium nozzle and horn assemblies make the ServoSonic an ideal solution for high solids and aggressive water soluble fluxes.

The ServoSonic benefits include:

• Ultrasonic atomized air delivery system;
• Ability to spray in one or both directions;
• Reduced flux consumption;
• Reduced maintenance costs;
• Selective flux capability;
• 100% integrated into wave solder machine software providing data logging and trending capability;
• Applies to a wide range of fluxes

Electrovert’s flux flow monitor is intended for applications that flux flow verification is critical to the wave soldering process. The feature provides an accurate method of verifying repeatability of the flux flow rate and flux volume on a board-to-board basis. The flux flow monitor uses an innovative non-contact type sensor. This approach allows the feature to be compatible across a broad range of flux types and spray technologies.

Flux Flow Monitor Features:

• Compatible with a broad range of flux types:
  • Alcohol and water based
  • Low to high solid content
  • Mild to highly corrosive
• Available on Electra, VectraElite, and VectraES (single and dual-head type fluxers)
  • ServoJet
  • ServoSpray
  • ServoSonic
• Feature is field upgradable (check with the factory on vintage and configuration of machine)

Flux Flow Monitor - Brochure

The Electra is capable of up to 2.4 meters (8 feet) of bottom side preheat and up to 1.8 meters (6 feet) of topside preheat.  Multiple forms of preheat are offered for complete process flexibility; these include IsoThermal™ forced convection, fast response IR, and Infrared radiant.  All preheat modules are ‘plug and play’, allowing preheat configurations to be located in any position, location, and 100% interchangeable.

Electrovert’s quick change solder pot allows the use of two or more alloys with easy change-over of interchangeable solder pots.  This feature is designed for safety, beginning with a robust cart that includes locking devices and safety bars to secure the pot.  The quick-change electrical and nitrogen utilities simplify change-over while the warming station (included) significantly reduces changeover time.

Quick-change pot benefits include:

• Use of multiple alloys;
• Built-in safety features;
• All critical process features of the wave solder machine remain integrated between the multiple solder pots:
  • Standard wave features such as FloLift, stand-by-mode, RPM control, alarms, and data logging;
  • Auto-lead clearance;
  • Optional ExactaWave (auto wave-height control);
• One pot/cart can be used on multiple machines of the same model and vintage (check with factory);
• Field upgradable

Electrovert’s Electra, VectraElite, and VectraES2 offer a wide range of features and capabilities that increase the value of the wave solder process.  The value is achieved through reliability, features that provide process flexibility, maximize process control, and ultimately save time and money.

Value-based features include:

• Lifetime warranty on solder pot casting (applies to original owner);
• Recipe-driven automatic lead clearance;
• FloLift™ technology increases the upward force of the waves just as the PCB passes over the wave.  This feature promotes maximum topside hole fill;
• Stand-by-mode of solder waves that reduces the rpm of the solder wave just until the PCB is near the solder pot.  This feature reduces dross generation when no PCBs are being soldered;
• Combination 2d/1d bar code reader can be combined with data logging for complete process control and automation;
• Data-logging and trending of critical machine parameters;
• Common Windows® based operating system and common GUI software across all Electrovert products (Wave, Reflow, and Cleaning).  This is a significant time saver to operators and engineers.  Minimal training is required when shifting from one product to another.
• Common I/O interface across all Electrovert products (Wave, Reflow, and Cleaning).  This is significant to maintenance personnel and significant in that common spare parts can be used from one product to another.