Automated dispensing of electronic materials in fluidic form is employed across the full range of electronics manufacturing, from board-level assembly to semiconductor applications. Materials dispensed can range from very low (water like) to very high (toothpaste like) viscosity and encompass many different functions. These include solder paste to electrically connect components, encapsulants to protect devices from atmospheric conditions, Thermal Interface Materials (TIMs) to help dissipate heat from parts, and adhesives to attach parts to a substrate or assembly.