Spray Nozzle Configurations in an Inline Cleaner and its Effects on Cleanliness

Cleaning electronic assemblies, or PCBs (Printed Circuit Boards), has been essential for many years. As PCB board density has increased and standoff height has decreased, so have cleaning challenges. Numerous technical studies published over the years have confirmed that post reflow flux residues resulting from No Clean, RMA and Water Soluble solder pastes can lead to failure mechanisms such as leakage current, electrochemical migration and dendritic growth, an unacceptable consequence particularly for high reliable electronic applications.

Cleaning systems have also evolved over the years as well as the cleaning agents available. In recent years, engineered aqueous based cleaning agents have become prominent due to the safety of use and reduced environmental impact as compared to solvent options. Thus, spray in air cleaning equipment is widely used throughout the electronics industry.