MPM Printers Features

Edison II ACT Stencil Printer

Advanced Print Head

Single axis closed-loop pressure control for dual squeegee eliminates front-to-back variation; a single high precision load cell provides squeegee force, and a unique algorithm calibrates out non-linearity, maintaining the set pressure across the entire board surface.

Automated Paste Changeover

The automated paste changeover system features a carousel that holds three 12 oz. or 6 oz. cartridges.  The printer unloads the used cartridge into the carousel which then spins into position for a new cartridge to be loaded.  A built-in barcode scanner verifies that the correct cartridge is being loaded.  A side door on the printer allows loading and removal of cartridges on the fly without stopping production. Indicator lights above the door lets the operator know if they correct paste for the selected process is loaded or if a cartridge is missing or needs attention. 

Automated Stencil, Squeegee, and Tooling Changeover

Edison II ACT completely automates the changeover of the stencil, tooling and squeegees. It provides a fast and consistent changeover without opening the hood of machine to access inside.  The operator removes the current run stencil from the printer and then loads a tray that holds the next run squeegees and tooling.  The Edison II ACT then automatically removes the current run squeegees and support tooling and loads them onto the tray.  The printer then automatically installs the next run items, and the operators removed the tray.

Board Staging

Ability to have three boards in the machine simultaneously, reduced distance on input conveyor by pre-loading the board during the print process results in reduced transfer times and improved cycle time.

EdgeLoc Board Clamping System

The EdgeLoc system uses a side snugging technique that removes the need for top clamps which interfere with the PCB to stencil contact. The result is optimal gasketing and more volumetrically consistent edge-to-edge prints. With EdgeLoc II, robust flippers engage to secure the board across the top edge ensuring board flatness then move out of the way once the board is firmly gripped from the side. EdgeLoc+ board clamping can change between edge and top clamping simply through software.

EdgeLoc -  Brochure

High Flow Venturi with Closed-loop

NEW The High Flow Venturi System with closed-loop control represents a major advancement, blending digital programmability with exceptional flexibility and simplicity in setup. Its precise programmability, adaptability to different substrate thicknesses, and focus on maintaining quality consistency make it an invaluable asset for boosting productivity and yield.

High Flow Venturi video - English

High Flow Venturi video - Chinese

High Speed Vision Alignment with Ultra-slim Camera

Edison features a high-speed vision alignment system with an ultra-thin camera. The overall gantry thickness is only 39 mm featuring an ‘on the fly’ ‘POE’ (Power Over Ethernet) camera. A single CCD split field provides precision simultaneous up-down image acquisition with a field of view 9.0 x 6.0 mm.

Intueri and Industry 4.0 Integration

MPM Intueri is a simple, intuitive operator interface with a flexible, wide array of configuration variables. It is combined with Open Apps for maximum capability and connectivity and provides a portal to Industry 4.0 concepts.

OpenApps™ is an open application interface with a development kit that allows customers to develop custom interfaces in support of Industry 4.0 initiatives. Using OpenApps we can provide support for factory automation standards such as Hermes and Pulse and communication with Manufacturing Execution Systems (MES). MPM printers support industry standards like CamX, SECS/GEM and SMEMA.

The Edison SECS/GEM package provides a ready-made interface that enables MES integration for product verification, traceability, and other MES functionalities. SECS/GEM is a semiconductor industry communication standard that provides a common interface for MES connectivity.

Paste Height Monitor

The Paste Height Monitor is designed to prevent defects caused y inadequate volumes of paste on the stencil. It combines advanced software and sensor technology to accurately monitor the paste bead for volume consistency. Upper and lower limit roll-height monitoring eliminates insufficient or excess paste volumes. It is a non-contact solution that can automatically add more paste to the stencil as it is needed.

Paste Height Monitor - Brochure

PrinTrack

The PrinTrack feature adds traceability, data harvesting, and reporting to your printing process. With PrinTrack, you always have an easy access to a comprehensive history, detailing:

  • How your product was printed
  • When it was printed 
  • The process parameters used to print the board
  • All pertinent information that can be used to track products or troubleshoot the process if needed.

A flexible web reporting interface can be user-configured to produce traceability reports.

PrinTrack - Brochure FAQ

SPI Print Optimizer

SPI Print Optimizer brings your Solder Paste Inspection (SPI) machine into communication with your MPM printer through a specially-developed common interface. When the SPI machine ‘sees’ X, Y and theta offset problems on a just-printed PCB, it analyzes the data virtually instantly and gives the printer instructions to correct those offsets, automatically, and ‘on the fly’.

SPI Print Optimizer - Brochure

Unparalleled Throughput and Speed

The Edison printer delivers an impressive 2X throughputcompared to competitive printers: 15 seconds total throughput - including stencil wipe cycle.

That’s due in part to an all new highly-efficient parallel processing stencil shuttle system, wiper, vision gantry, and other cycle time reduction and innovations so that Edison delivers double the throughput of best-in-class printers worldwide.

Unprecendented Access and Back to Back (BTB) Configurable

The Edison recessed front design provides unprecedented access to tooling for easier service without reaching, bending, or fatigue. Edison can also be configured Back-to-Back for a flexible dual lane solution without adding line length.

Ultra-fast, High Efficiency Wiping System

A super-size 65m paper roll allows 10,000 prints per change. Patented paper tension control provides more effective wiping and a separate wiping and printing zone prevents cross contamination.