AccuCheck Print Capability Verification allows the printer to measure its own print capability. Users can verify the machine’s capability at any time or continuously on their own products. AccuCheck measures the actual print deposit position versus the target pad to determine a measured print offset. It is an inexpensive, reliable method of obtaining machine quality and process capability information to ensure repeatable results and optimum printing performance.

Dispense for standard cartridges or choose the new patent-pending jar dispenser. Paste is released in precise, measured amounts across the stencil in a clean, uniform bead. Deposition volumes, frequency and placement are user programmable.

Auotmatic Paste Dispenser - Brochure

Easy to learn and use for the average operator, MPM’s Benchmark software is powerful yet intuitive, and facilitates rapid setup, assists with operational tasks, and makes changeover quick and easy. The software has been upgraded to Windows 10 and new production tools and new Quickstart programming to make it even easier to use.

The BridgeVision™ system is a patented method of analyzing bridge defects on circuit boards during the post-print inspection process.

This innovative system uses  texture-based image acquisition algorithms and a digital camera system with telecentric lenses to support the accurate identification of paste deposit defects.

• Finds bridging defects post-print – before they go to reflow
• Patented contrast and texture-based technologies
• Combines with SPC tools

The BridgeVision system operates simultaneously with the MPM 2D paste inspection system.

NEW The High Flow Venturi System with closed-loop control represents a major advancement, blending digital programmability with exceptional flexibility and simplicity in setup. Its precise programmability, adaptability to different substrate thicknesses, and focus on maintaining quality consistency make it an invaluable asset for boosting productivity and yield.

High Flow Venturi video - English

High Flow Venturi video - Chinese

MPM’s OpenApps is an open architecture source code which provides the capability of developing custom interfaces in support of Industry 4.0 initiatives and communication with Manufacturing Execution Systems (MES). ITW EAE is the first SMT company to offer open software architecture.

The Paste Height Monitor is designed to prevent defects caused y inadequate volumes of paste on the stencil. It combines advanced software and sensor technology to accurately monitor the paste bead for volume consistency. Upper and lower limit roll-height monitoring eliminates insufficient or excess paste volumes. It is a non-contact solution that can automatically add more paste to the stencil as it is needed.

Paste Height Monitor - Brochure

Temperature monitoring ensures proper paste viscosity to avoid bridging and voiding. MPM patent- pending paste temperature monitor allows paste to be measured in the cartridge or on the stencil.

Paste Temperature Monitor - Brochure

PrinTrack™ adds traceability, data harvesting and reporting to your printing process. It can seamlessly integrate with other equipment and elements in the manufacturing cycle, such as MES and ERP, and can be expanded factory-wide.

PrintTrack - Brochure & FAQs

RapidClean is a high speed stencil solvent cleaning innovation that slashes cycle time and improves stencil cleaning performance, especially for fine-pitch. RapidClean reduces 3 wipe strokes to 2 and cuts cycle time by 5 – 6 seconds per print cycle over the standard wiper; and because fewer cleaning cycles are required, RapidClean can save up to $10K USD per annum in paper savings per printer.

RapidClean - Brochure FAQ

The StencilVision™ system uses texture-based technology and a digital camera system to check the underside of a stencil for solder paste contamination. The results of the check drive wiper operation.

The StencilVision system:

• Detects solder paste seepage from apertures to stencil underside
• Initiates underside stencil wiping sequence to remove contamination
• Prevents print defects, contamination of PCB caused by dirty stencil underside
• Efficient – initiates wiping only when needed

Ensures optimum stencil to board gasketing

SPI Print Optimizer brings your Solder Paste Inspection (SPI) machine into communication with your MPM printer through a specially-developed common interface. When the SPI machine ‘sees’ X, Y and theta offset problems on a just-printed PCB, it analyzes the data virtually instantly and gives the printer instructions to correct those offsets, automatically, and ‘on the fly’.

SPI Print Optimizer - Brochure

MPM’s patented printe rbased Vision and Inspection system is a cost-effective way to verify print and paste deposit results. It is flexible enough to handle the complete range of today’s most challenging components. This system measures the amount of paste covering the target pad and compares it with the required coverage. 2D inspection is integrated directly into the stencil printer to provide an immediate source of data.

AccuCheck Print Capability Verification allows the printer to measure its own print capability. Users can verify the machine’s capability at any time or continuously on their own products. AccuCheck measures the actual print deposit position versus the target pad to determine a measured print offset. It is an inexpensive, reliable method of obtaining machine quality and process capability information to ensure repeatable results and optimum printing performance.

Dispense for standard cartridges or choose the new patent-pending jar dispenser. Paste is released in precise, measured amounts across the stencil in a clean, uniform bead. Deposition volumes, frequency and placement are user programmable.

Auotmatic Paste Dispenser - Brochure

Easy to learn and use for the average operator, MPM’s Benchmark software is powerful yet intuitive, and facilitates rapid setup, assists with operational tasks, and makes changeover quick and easy. The software has been upgraded to Windows 10 and new production tools and new Quickstart programming to make it even easier to use.

The BridgeVision™ system is a patented method of analyzing bridge defects on circuit boards during the post-print inspection process.

This innovative system uses  texture-based image acquisition algorithms and a digital camera system with telecentric lenses to support the accurate identification of paste deposit defects.

• Finds bridging defects post-print – before they go to reflow
• Patented contrast and texture-based technologies
• Combines with SPC tools

The BridgeVision system operates simultaneously with the MPM 2D paste inspection system.

The EdgeLoc system uses a side snugging technique that removes the need for top clamps which interfere with the PCB to stencil contact. The result is optimal gasketing and more volumetrically consistent edge-to-edge prints. With EdgeLoc II, robust flippers engage to secure the board across the top edge ensuring board flatness then move out of the way once the board is firmly gripped from the side. EdgeLoc+ board clamping can change between edge and top clamping simply through software.

EdgeLoc -  Brochure

The MPM EnclosedFlow Print Head delivers uniform aperture filling and superb printing performance especially for fine pitch devices, with tremendous savings on solder paste over squeegee blade printing – in excess of 50% over blades for dramatically fast ROI. Printing fine features such as 01005s and 0.3mm pitch CSPs with up to 50% greater volume and 25% lower deviation than metal blades.

EnclosedFlow - Brochure & FAQ

NEW The High Flow Venturi System with closed-loop control represents a major advancement, blending digital programmability with exceptional flexibility and simplicity in setup. Its precise programmability, adaptability to different substrate thicknesses, and focus on maintaining quality consistency make it an invaluable asset for boosting productivity and yield.

High Flow Venturi video - English

High Flow Venturi video - Chinese

MPM’s OpenApps is an open architecture source code which provides the capability of developing custom interfaces in support of Industry 4.0 initiatives and communication with Manufacturing Execution Systems (MES). ITW EAE is the first SMT company to offer open software architecture.

The Paste Height Monitor is designed to prevent defects caused y inadequate volumes of paste on the stencil. It combines advanced software and sensor technology to accurately monitor the paste bead for volume consistency. Upper and lower limit roll-height monitoring eliminates insufficient or excess paste volumes. It is a non-contact solution that can automatically add more paste to the stencil as it is needed.

Paste Height Monitor - Brochure

Temperature monitoring ensures proper paste viscosity to avoid bridging and voiding. MPM patent- pending paste temperature monitor allows paste to be measured in the cartridge or on the stencil.

Paste Temperature Monitor - Brochure

PrinTrack™ adds traceability, data harvesting and reporting to your printing process. It can seamlessly integrate with other equipment and elements in the manufacturing cycle, such as MES and ERP, and can be expanded factory-wide.

PrintTrack - Brochure & FAQs

RapidClean is a high speed stencil solvent cleaning innovation that slashes cycle time and improves stencil cleaning performance, especially for fine-pitch. RapidClean reduces 3 wipe strokes to 2 and cuts cycle time by 5 – 6 seconds per print cycle over the standard wiper; and because fewer cleaning cycles are required, RapidClean can save up to $10K USD per annum in paper savings per printer.

RapidClean - Brochure FAQ

SPI Print Optimizer brings your Solder Paste Inspection (SPI) machine into communication with your MPM printer through a specially-developed common interface. When the SPI machine ‘sees’ X, Y and theta offset problems on a just-printed PCB, it analyzes the data virtually instantly and gives the printer instructions to correct those offsets, automatically, and ‘on the fly’.

SPI Print Optimizer - Brochure

The StencilVision™ system uses texture-based technology and a digital camera system to check the underside of a stencil for solder paste contamination. The results of the check drive wiper operation.

The StencilVision system:

• Detects solder paste seepage from apertures to stencil underside
• Initiates underside stencil wiping sequence to remove contamination
• Prevents print defects, contamination of PCB caused by dirty stencil underside
• Efficient – initiates wiping only when needed

Ensures optimum stencil to board gasketing

MPM’s patented printe rbased Vision and Inspection system is a cost-effective way to verify print and paste deposit results. It is flexible enough to handle the complete range of today’s most challenging components. This system measures the amount of paste covering the target pad and compares it with the required coverage. 2D inspection is integrated directly into the stencil printer to provide an immediate source of data.

AccuCheck Print Capability Verification allows the printer to measure its own print capability. Users can verify the machine’s capability at any time or continuously on their own products. AccuCheck measures the actual print deposit position versus the target pad to determine a measured print offset. It is an inexpensive, reliable method of obtaining machine quality and process capability information to ensure repeatable results and optimum printing performance.

Dispense for standard cartridges or choose the new patent-pending jar dispenser. Paste is released in precise, measured amounts across the stencil in a clean, uniform bead. Deposition volumes, frequency and placement are user programmable.

Auotmatic Paste Dispenser - Brochure

Automatic Pin Placement is a patented MPM tooling solution that uses the vision gantry to precisely place and remove pins. Pin patterns are software programmable and ensure quick, easy, and repeatable product changeover.

Easy to learn and use for the average operator, MPM’s Benchmark software is powerful yet intuitive, and facilitates rapid setup, assists with operational tasks, and makes changeover quick and easy. The software has been upgraded to Windows 10 and new production tools and new Quickstart programming to make it even easier to use.

The BridgeVision™ system is a patented method of analyzing bridge defects on circuit boards during the post-print inspection process.

This innovative system uses  texture-based image acquisition algorithms and a digital camera system with telecentric lenses to support the accurate identification of paste deposit defects.

• Finds bridging defects post-print – before they go to reflow
• Patented contrast and texture-based technologies
• Combines with SPC tools

The BridgeVision system operates simultaneously with the MPM 2D paste inspection system.

Nur ITW EAE, mit seinen Kernkompetenzen im Drucken UND Dispensen, kann beide Prozesse vereinen - zum Vorteil seiner Kunden. Camalot Inside besteht aus zwei, in ein Drucksystem integrierte Dispenspumpen, die ultimative Flexibilität bieten: es können zwei unterschiedliche Materialien dispenst werden oder ein Material mit zwei Nadelgrößen für unterschiedliche Punktgrößen, was die Dispensgeschwindigkeit bzw. den Durchsatz verdoppelt.

The EdgeLoc system uses a side snugging technique that removes the need for top clamps which interfere with the PCB to stencil contact. The result is optimal gasketing and more volumetrically consistent edge-to-edge prints. With EdgeLoc II, robust flippers engage to secure the board across the top edge ensuring board flatness then move out of the way once the board is firmly gripped from the side. EdgeLoc+ board clamping can change between edge and top clamping simply through software.

EdgeLoc -  Brochure

The MPM EnclosedFlow Print Head delivers uniform aperture filling and superb printing performance especially for fine pitch devices, with tremendous savings on solder paste over squeegee blade printing – in excess of 50% over blades for dramatically fast ROI. Printing fine features such as 01005s and 0.3mm pitch CSPs with up to 50% greater volume and 25% lower deviation than metal blades.

EnclosedFlow - Brochure & FAQ

NEW The High Flow Venturi System with closed-loop control represents a major advancement, blending digital programmability with exceptional flexibility and simplicity in setup. Its precise programmability, adaptability to different substrate thicknesses, and focus on maintaining quality consistency make it an invaluable asset for boosting productivity and yield.

High Flow Venturi video - English

High Flow Venturi video - Chinese

MPM’s OpenApps is an open architecture source code which provides the capability of developing custom interfaces in support of Industry 4.0 initiatives and communication with Manufacturing Execution Systems (MES). ITW EAE is the first SMT company to offer open software architecture.

The Paste Height Monitor is designed to prevent defects caused y inadequate volumes of paste on the stencil. It combines advanced software and sensor technology to accurately monitor the paste bead for volume consistency. Upper and lower limit roll-height monitoring eliminates insufficient or excess paste volumes. It is a non-contact solution that can automatically add more paste to the stencil as it is needed.

Paste Height Monitor - Brochure

Temperature monitoring ensures proper paste viscosity to avoid bridging and voiding. MPM patent- pending paste temperature monitor allows paste to be measured in the cartridge or on the stencil.

Paste Temperature Monitor - Brochure

PrinTrack™ adds traceability, data harvesting and reporting to your printing process. It can seamlessly integrate with other equipment and elements in the manufacturing cycle, such as MES and ERP, and can be expanded factory-wide.

PrinTrack - Brochure & FAQ

New quick release squeegee blades make changing blades quick and easy with no tools required.  It takes less than 30 seconds to change the blade.

RapidClean is a high speed stencil solvent cleaning innovation that slashes cycle time and improves stencil cleaning performance, especially for fine-pitch. RapidClean reduces 3 wipe strokes to 2 and cuts cycle time by 5 – 6 seconds per print cycle over the standard wiper; and because fewer cleaning cycles are required, RapidClean can save up to $10K USD per annum in paper savings per printer.

RapidClean - Brochure FAQ

Built on our patented optics technology, RapidView system delivers high-speed 2D inspection with device-level SPC reporting. RapidView inspection is up to three and half times faster than our standard system, can increase Field of View (FOE) 4x, and can work in conjunction with our GerberEZ Teach system.

SPI Print Optimizer brings your Solder Paste Inspection (SPI) machine into communication with your MPM printer through a specially-developed common interface. When the SPI machine ‘sees’ X, Y and theta offset problems on a just-printed PCB, it analyzes the data virtually instantly and gives the printer instructions to correct those offsets, automatically, and ‘on the fly’.

SPI Print Optimizer - Brochure

The StencilVision™ system uses texture-based technology and a digital camera system to check the underside of a stencil for solder paste contamination. The results of the check drive wiper operation.

The StencilVision system:

• Detects solder paste seepage from apertures to stencil underside
• Initiates underside stencil wiping sequence to remove contamination
• Prevents print defects, contamination of PCB caused by dirty stencil underside
• Efficient – initiates wiping only when needed

Ensures optimum stencil to board gasketing

MPM’s patented printe rbased Vision and Inspection system is a cost-effective way to verify print and paste deposit results. It is flexible enough to handle the complete range of today’s most challenging components. This system measures the amount of paste covering the target pad and compares it with the required coverage. 2D inspection is integrated directly into the stencil printer to provide an immediate source of data.

AccuCheck Print Capability Verification allows the printer to measure its own print capability. Users can verify the machine’s capability at any time or continuously on their own products. AccuCheck measures the actual print deposit position versus the target pad to determine a measured print offset. It is an inexpensive, reliable method of obtaining machine quality and process capability information to ensure repeatable results and optimum printing performance.

Dispense for standard cartridges or choose the new patent-pending jar dispenser. Paste is released in precise, measured amounts across the stencil in a clean, uniform bead. Deposition volumes, frequency and placement are user programmable.

Auotmatic Paste Dispenser - Brochure

Automatic Pin Placement is a patented MPM tooling solution that uses the vision gantry to precisely place and remove pins. Pin patterns are software programmable and ensure quick, easy, and repeatable product changeover.

Easy to learn and use for the average operator, MPM’s Benchmark software is powerful yet intuitive, and facilitates rapid setup, assists with operational tasks, and makes changeover quick and easy. The software has been upgraded to Windows 10 and new production tools and new Quickstart programming to make it even easier to use.

The BridgeVision™ system is a patented method of analyzing bridge defects on circuit boards during the post-print inspection process.

This innovative system uses  texture-based image acquisition algorithms and a digital camera system with telecentric lenses to support the accurate identification of paste deposit defects.

• Finds bridging defects post-print – before they go to reflow
• Patented contrast and texture-based technologies
• Combines with SPC tools

The BridgeVision system operates simultaneously with the MPM 2D paste inspection system.

Only ITW EAE, with industry-leading core competencies in printer AND dispenser technologies, can bring both together to the customer’s advantage. Camalot Inside consists of two dispense pumps integrated into one printing machine. Camalot Inside provides ultimate flexibility, allowing the dispensing of two different materials, or the same material (doubling dispense throughput speed) with two needle sizes to easily administer multiple dot sizes.

Camalot Inside - Brochure & FAQ

Camalot Inside - Video

The EdgeLoc system uses a side snugging technique that removes the need for top clamps which interfere with the PCB to stencil contact. The result is optimal gasketing and more volumetrically consistent edge-to-edge prints. With EdgeLoc II, robust flippers engage to secure the board across the top edge ensuring board flatness then move out of the way once the board is firmly gripped from the side. EdgeLoc+ board clamping can change between edge and top clamping simply through software.

EdgeLoc -  Brochure

The MPM EnclosedFlow Print Head delivers uniform aperture filling and superb printing performance especially for fine pitch devices, with tremendous savings on solder paste over squeegee blade printing – in excess of 50% over blades for dramatically fast ROI. Printing fine features such as 01005s and 0.3mm pitch CSPs with up to 50% greater volume and 25% lower deviation than metal blades.

EnclosedFlow - Brochure & FAQ

NEW The High Flow Venturi System with closed-loop control represents a major advancement, blending digital programmability with exceptional flexibility and simplicity in setup. Its precise programmability, adaptability to different substrate thicknesses, and focus on maintaining quality consistency make it an invaluable asset for boosting productivity and yield.

High Flow Venturi video - English

High Flow Venturi video - Chinese

MPM’s OpenApps is an open architecture source code which provides the capability of developing custom interfaces in support of Industry 4.0 initiatives and communication with Manufacturing Execution Systems (MES). ITW EAE is the first SMT company to offer open software architecture.

Temperature monitoring ensures proper paste viscosity to avoid bridging and voiding. MPM patent- pending paste temperature monitor allows paste to be measured in the cartridge or on the stencil.

Paste Temperature Monitor - Brochure

The Paste Height Monitor is designed to prevent defects caused y inadequate volumes of paste on the stencil. It combines advanced software and sensor technology to accurately monitor the paste bead for volume consistency. Upper and lower limit roll-height monitoring eliminates insufficient or excess paste volumes. It is a non-contact solution that can automatically add more paste to the stencil as it is needed.

Paste Height Monitor - Brochure

PrinTrack™ adds traceability, data harvesting and reporting to your printing process. It can seamlessly integrate with other equipment and elements in the manufacturing cycle, such as MES and ERP, and can be expanded factory-wide.

PrinTrack - Brochure & FAQ

New quick release squeegee blades make changing blades quick and easy with no tools required.  It takes less than 30 seconds to change the blade.

RapidClean is a high speed stencil solvent cleaning innovation that slashes cycle time and improves stencil cleaning performance, especially for fine-pitch. RapidClean reduces 3 wipe strokes to 2 and cuts cycle time by 5 – 6 seconds per print cycle over the standard wiper; and because fewer cleaning cycles are required, RapidClean can save up to $10K USD per annum in paper savings per printer.

RapidClean - Brochure FAQ

Built on our patented optics technology, RapidView system delivers high-speed 2D inspection with device-level SPC reporting. RapidView inspection is up to three and half times faster than our standard system, can increase Field of View (FOE) 4x, and can work in conjunction with our GerberEZ Teach system.

SPI Print Optimizer brings your Solder Paste Inspection (SPI) machine into communication with your MPM printer through a specially-developed common interface. When the SPI machine ‘sees’ X, Y and theta offset problems on a just-printed PCB, it analyzes the data virtually instantly and gives the printer instructions to correct those offsets, automatically, and ‘on the fly’.

SPI Print Optimizer - Brochure

The StencilVision™ system uses texture-based technology and a digital camera system to check the underside of a stencil for solder paste contamination. The results of the check drive wiper operation.

The StencilVision system:

• Detects solder paste seepage from apertures to stencil underside
• Initiates underside stencil wiping sequence to remove contamination
• Prevents print defects, contamination of PCB caused by dirty stencil underside
• Efficient – initiates wiping only when needed

Ensures optimum stencil to board gasketing

MPM’s patented printe rbased Vision and Inspection system is a cost-effective way to verify print and paste deposit results. It is flexible enough to handle the complete range of today’s most challenging components. This system measures the amount of paste covering the target pad and compares it with the required coverage. 2D inspection is integrated directly into the stencil printer to provide an immediate source of data.

Single axis closed-loop pressure control for dual squeegee eliminates front-to-back variation; a single high precision load cell provides squeegee force, and a unique algorithm calibrates out non-linearity, maintaining the set pressure across the entire board surface.

The automated paste changeover system features a carousel that holds three 12 oz. or 6 oz. cartridges.  The printer unloads the used cartridge into the carousel which then spins into position for a new cartridge to be loaded.  A built-in barcode scanner verifies that the correct cartridge is being loaded.  A side door on the printer allows loading and removal of cartridges on the fly without stopping production. Indicator lights above the door lets the operator know if they correct paste for the selected process is loaded or if a cartridge is missing or needs attention. 

Edison II ACT completely automates the changeover of the stencil, tooling and squeegees. It provides a fast and consistent changeover without opening the hood of machine to access inside.  The operator removes the current run stencil from the printer and then loads a tray that holds the next run squeegees and tooling.  The Edison II ACT then automatically removes the current run squeegees and support tooling and loads them onto the tray.  The printer then automatically installs the next run items, and the operators removed the tray.

Ability to have three boards in the machine simultaneously, reduced distance on input conveyor by pre-loading the board during the print process results in reduced transfer times and improved cycle time.

The EdgeLoc system uses a side snugging technique that removes the need for top clamps which interfere with the PCB to stencil contact. The result is optimal gasketing and more volumetrically consistent edge-to-edge prints. With EdgeLoc II, robust flippers engage to secure the board across the top edge ensuring board flatness then move out of the way once the board is firmly gripped from the side. EdgeLoc+ board clamping can change between edge and top clamping simply through software.

EdgeLoc -  Brochure

NEW The High Flow Venturi System with closed-loop control represents a major advancement, blending digital programmability with exceptional flexibility and simplicity in setup. Its precise programmability, adaptability to different substrate thicknesses, and focus on maintaining quality consistency make it an invaluable asset for boosting productivity and yield.

High Flow Venturi video - English

High Flow Venturi video - Chinese

Edison features a high-speed vision alignment system with an ultra-thin camera. The overall gantry thickness is only 39 mm featuring an ‘on the fly’ ‘POE’ (Power Over Ethernet) camera. A single CCD split field provides precision simultaneous up-down image acquisition with a field of view 9.0 x 6.0 mm.

MPM Intueri is a simple, intuitive operator interface with a flexible, wide array of configuration variables. It is combined with Open Apps for maximum capability and connectivity and provides a portal to Industry 4.0 concepts.

OpenApps™ is an open application interface with a development kit that allows customers to develop custom interfaces in support of Industry 4.0 initiatives. Using OpenApps we can provide support for factory automation standards such as Hermes and Pulse and communication with Manufacturing Execution Systems (MES). MPM printers support industry standards like CamX, SECS/GEM and SMEMA.

The Edison SECS/GEM package provides a ready-made interface that enables MES integration for product verification, traceability, and other MES functionalities. SECS/GEM is a semiconductor industry communication standard that provides a common interface for MES connectivity.

The Paste Height Monitor is designed to prevent defects caused y inadequate volumes of paste on the stencil. It combines advanced software and sensor technology to accurately monitor the paste bead for volume consistency. Upper and lower limit roll-height monitoring eliminates insufficient or excess paste volumes. It is a non-contact solution that can automatically add more paste to the stencil as it is needed.

Paste Height Monitor - Brochure

The PrinTrack feature adds traceability, data harvesting, and reporting to your printing process. With PrinTrack, you always have an easy access to a comprehensive history, detailing:

• How your product was printed
• When it was printed 
• The process parameters used to print the board
• All pertinent information that can be used to track products or troubleshoot the process if needed.

A flexible web reporting interface can be user-configured to produce traceability reports.

PrinTrack - Brochure FAQ

SPI Print Optimizer brings your Solder Paste Inspection (SPI) machine into communication with your MPM printer through a specially-developed common interface. When the SPI machine ‘sees’ X, Y and theta offset problems on a just-printed PCB, it analyzes the data virtually instantly and gives the printer instructions to correct those offsets, automatically, and ‘on the fly’.

SPI Print Optimizer - Brochure

The Edison printer delivers an impressive 2X throughputcompared to competitive printers: 15 seconds total throughput - including stencil wipe cycle.

That’s due in part to an all new highly-efficient parallel processing stencil shuttle system, wiper, vision gantry, and other cycle time reduction and innovations so that Edison delivers double the throughput of best-in-class printers worldwide.

The Edison recessed front design provides unprecedented access to tooling for easier service without reaching, bending, or fatigue. Edison can also be configured Back-to-Back for a flexible dual lane solution without adding line length.

A super-size 65m paper roll allows 10,000 prints per change. Patented paper tension control provides more effective wiping and a separate wiping and printing zone prevents cross contamination.

Single axis closed-loop pressure control for dual squeegee eliminates front-to-back variation; a single high precision load cell provides squeegee force, and a unique algorithm calibrates out non-linearity, maintaining the set pressure across the entire board surface.

Ability to have three boards in the machine simultaneously, reduced distance on input conveyor by pre-loading the board during the print process results in reduced transfer times and improved cycle time.

The EdgeLoc system uses a side snugging technique that removes the need for top clamps which interfere with the PCB to stencil contact. The result is optimal gasketing and more volumetrically consistent edge-to-edge prints. With EdgeLoc II, robust flippers engage to secure the board across the top edge ensuring board flatness then move out of the way once the board is firmly gripped from the side. EdgeLoc+ board clamping can change between edge and top clamping simply through software.

EdgeLoc -  Brochure

Edison features a high-speed vision alignment system with an ultra-thin camera. The overall gantry thickness is only 39 mm featuring an ‘on the fly’ ‘POE’ (Power Over Ethernet) camera. A single CCD split field provides precision simultaneous up-down image acquisition with a field of view 9.0 x 6.0 mm.

MPM Intueri is a simple, intuitive operator interface with a flexible, wide array of configuration variables. It is combined with Open Apps for maximum capability and connectivity and provides a portal to Industry 4.0 concepts.

OpenApps™ is an open application interface with a development kit that allows customers to develop custom interfaces in support of Industry 4.0 initiatives. Using OpenApps we can provide support for factory automation standards such as Hermes and Pulse and communication with Manufacturing Execution Systems (MES). MPM printers support industry standards like CamX, SECS/GEM and SMEMA.

The Edison SECS/GEM package provides a ready-made interface that enables MES integration for product verification, traceability, and other MES functionalities. SECS/GEM is a semiconductor industry communication standard that provides a common interface for MES connectivity.

The Paste Height Monitor is designed to prevent defects caused y inadequate volumes of paste on the stencil. It combines advanced software and sensor technology to accurately monitor the paste bead for volume consistency. Upper and lower limit roll-height monitoring eliminates insufficient or excess paste volumes. It is a non-contact solution that can automatically add more paste to the stencil as it is needed.

Paste Height Monitor - Brochure

PrinTrack™ adds traceability, data harvesting and reporting to your printing process. It can seamlessly integrate with other equipment and elements in the manufacturing cycle, such as MES and ERP, and can be expanded factory-wide.

PrintTrack - Brochure & FAQs

SPI Print Optimizer brings your Solder Paste Inspection (SPI) machine into communication with your MPM printer through a specially-developed common interface. When the SPI machine ‘sees’ X, Y and theta offset problems on a just-printed PCB, it analyzes the data virtually instantly and gives the printer instructions to correct those offsets, automatically, and ‘on the fly’.

SPI Print Optimizer - Brochure

The Edison printer delivers an impressive 2X throughputcompared to competitive printers: 15 seconds total throughput - including stencil wipe cycle.

That’s due in part to an all new highly-efficient parallel processing stencil shuttle system, wiper, vision gantry, and other cycle time reduction and innovations so that Edison delivers double the throughput of best-in-class printers worldwide.

The Edison recessed front design provides unprecedented access to tooling for easier service without reaching, bending, or fatigue. Edison can also be configured Back-to-Back for a flexible dual lane solution without adding line length.

A super-size 65m paper roll allows 10,000 prints per change. Patented paper tension control provides more effective wiping and a separate wiping and printing zone prevents cross contamination.

Single axis closed-loop pressure control for dual squeegee eliminates front-to-back variation; a single high precision load cell provides squeegee force, and a unique algorithm calibrates out non-linearity, maintaining the set pressure across the entire board surface.

Ability to have three boards in the machine simultaneously, reduced distance on input conveyor by pre-loading the board during the print process results in reduced transfer times and improved cycle time.

The EdgeLoc system uses a side snugging technique that removes the need for top clamps which interfere with the PCB to stencil contact. The result is optimal gasketing and more volumetrically consistent edge-to-edge prints. With EdgeLoc II, robust flippers engage to secure the board across the top edge ensuring board flatness then move out of the way once the board is firmly gripped from the side. EdgeLoc+ board clamping can change between edge and top clamping simply through software.

EdgeLoc -  Brochure

Edison features a high-speed vision alignment system with an ultra-thin camera. The overall gantry thickness is only 39 mm featuring an ‘on the fly’ ‘POE’ (Power Over Ethernet) camera. A single CCD split field provides precision simultaneous up-down image acquisition with a field of view 9.0 x 6.0 mm.

MPM’s OpenApps is an open architecture source code which provides the capability of developing custom interfaces in support of Industry 4.0 initiatives and communication with Manufacturing Execution Systems (MES). ITW EAE is the first SMT company to offer open software architecture.

MPM Intueri is a simple, intuitive operator interface with a flexible, wide array of configuration variables. It is combined with Open Apps for maximum capability and connectivity and provides a portal to Industry 4.0 concepts.

OpenApps™ is an open application interface with a development kit that allows customers to develop custom interfaces in support of Industry 4.0 initiatives. Using OpenApps we can provide support for factory automation standards such as Hermes and Pulse and communication with Manufacturing Execution Systems (MES). MPM printers support industry standards like CamX, SECS/GEM and SMEMA.

The Edison SECS/GEM package provides a ready-made interface that enables MES integration for product verification, traceability, and other MES functionalities. SECS/GEM is a semiconductor industry communication standard that provides a common interface for MES connectivity.

The Paste Height Monitor is designed to prevent defects caused y inadequate volumes of paste on the stencil. It combines advanced software and sensor technology to accurately monitor the paste bead for volume consistency. Upper and lower limit roll-height monitoring eliminates insufficient or excess paste volumes. It is a non-contact solution that can automatically add more paste to the stencil as it is needed.

Paste Height Monitor - Brochure

PrinTrack™ adds traceability, data harvesting and reporting to your printing process. It can seamlessly integrate with other equipment and elements in the manufacturing cycle, such as MES and ERP, and can be expanded factory-wide.

PrintTrack - Brochure & FAQs

SPI Print Optimizer brings your Solder Paste Inspection (SPI) machine into communication with your MPM printer through a specially-developed common interface. When the SPI machine ‘sees’ X, Y and theta offset problems on a just-printed PCB, it analyzes the data virtually instantly and gives the printer instructions to correct those offsets, automatically, and ‘on the fly’.

SPI Print Optimizer - Brochure

The Edison printer delivers an impressive 2X throughputcompared to competitive printers: 15 seconds total throughput - including stencil wipe cycle.

That’s due in part to an all new highly-efficient parallel processing stencil shuttle system, wiper, vision gantry, and other cycle time reduction and innovations so that Edison delivers double the throughput of best-in-class printers worldwide.

The Edison recessed front design provides unprecedented access to tooling for easier service without reaching, bending, or fatigue. Edison can also be configured Back-to-Back for a flexible dual lane solution without adding line length.

A super-size 65m paper roll allows 10,000 prints per change. Patented paper tension control provides more effective wiping and a separate wiping and printing zone prevents cross contamination.

AccuCheck Print Capability Verification allows the printer to measure its own print capability. Users can verify the machine’s capability at any time or continuously on their own products. AccuCheck measures the actual print deposit position versus the target pad to determine a measured print offset. It is an inexpensive, reliable method of obtaining machine quality and process capability information to ensure repeatable results and optimum printing performance.

Dispense for standard cartridges or choose the new patent-pending jar dispenser. Paste is released in precise, measured amounts across the stencil in a clean, uniform bead. Deposition volumes, frequency and placement are user programmable.

Auotmatic Paste Dispenser - Brochure

Easy to learn and use for the average operator, MPM’s Benchmark software is powerful yet intuitive, and facilitates rapid setup, assists with operational tasks, and makes changeover quick and easy. The software has been upgraded to Windows 10 and new production tools and new Quickstart programming to make it even easier to use.

The BridgeVision™ system is a patented method of analyzing bridge defects on circuit boards during the post-print inspection process.

This innovative system uses  texture-based image acquisition algorithms and a digital camera system with telecentric lenses to support the accurate identification of paste deposit defects.

• Finds bridging defects post-print – before they go to reflow
• Patented contrast and texture-based technologies
• Combines with SPC tools

The BridgeVision system operates simultaneously with the MPM 2D paste inspection system.

The EdgeLoc system uses a side snugging technique that removes the need for top clamps which interfere with the PCB to stencil contact. The result is optimal gasketing and more volumetrically consistent edge-to-edge prints. With EdgeLoc II, robust flippers engage to secure the board across the top edge ensuring board flatness then move out of the way once the board is firmly gripped from the side. EdgeLoc+ board clamping can change between edge and top clamping simply through software.

EdgeLoc -  Brochure

The EnclosedFlow print head offers significant process and cost advantages over printing with metal squeegee blades, particularly for fine-feature printing. Solder paste is held within an enclosed chamber, and is directly pressurized during the print stroke to provide uniform and complete aperture filling for the full range of aperture sizes and fill types.

The EnclosedFlow print head delivers superior volume/yield on fine pitch pads. Print fine pitch features such as 01005s and 0.3 mm pitch CSPs with up to 50% greater volume and 25% lower deviation that squeegee blades. The EnclosedFlow print head ensures optimal aperture filling for fine pitch devices and crisp uniform printing with less waste.

EnclosedFlow - Brochure and FAQs

MPM’s OpenApps is an open architecture source code which provides the capability of developing custom interfaces in support of Industry 4.0 initiatives and communication with Manufacturing Execution Systems (MES). ITW EAE is the first SMT company to offer open software architecture.

MPM’s patented printe rbased Vision and Inspection system is a cost-effective way to verify print and paste deposit results. It is flexible enough to handle the complete range of today’s most challenging components. This system measures the amount of paste covering the target pad and compares it with the required coverage. 2D inspection is integrated directly into the stencil printer to provide an immediate source of data.

The Paste Height Monitor is designed to prevent defects caused y inadequate volumes of paste on the stencil. It combines advanced software and sensor technology to accurately monitor the paste bead for volume consistency. Upper and lower limit roll-height monitoring eliminates insufficient or excess paste volumes. It is a non-contact solution that can automatically add more paste to the stencil as it is needed.

Paste Height Monitor - Brochure

Temperature monitoring ensures proper paste viscosity to avoid bridging and voiding. MPM patent- pending paste temperature monitor allows paste to be measured in the cartridge or on the stencil.

Paste Temperature Monitor - Brochure

PrinTrack™ adds traceability, data harvesting and reporting to your printing process. It can seamlessly integrate with other equipment and elements in the manufacturing cycle, such as MES and ERP, and can be expanded factory-wide.

PrintTrack - Brochure & FAQs

RapidClean is a high-speed under-stencil cleaning system offered on MPM Momentum series printers. RapidClean is the fastest stencil cleaning solution available.

RapidClean - Brochure

SPI Print Optimizer brings your Solder Paste Inspection (SPI) machine into communication with your MPM printer through a specially-developed common interface. When the SPI machine ‘sees’ X, Y and theta offset problems on a just-printed PCB, it analyzes the data virtually instantly and gives the printer instructions to correct those offsets, automatically, and ‘on the fly’.

SPI Print Optimizer - Brochure

The StencilVision™ system uses texture-based technology and a digital camera system to check the underside of a stencil for solder paste contamination. The results of the check drive wiper operation.

The StencilVision system:

• Detects solder paste seepage from apertures to stencil underside
• Initiates underside stencil wiping sequence to remove contamination
• Prevents print defects, contamination of PCB caused by dirty stencil underside
• Efficient – initiates wiping only when needed

Ensures optimum stencil to board gasketing

AccuCheck Print Capability Verification allows the printer to measure its own print capability. Users can verify the machine’s capability at any time or continuously on their own products. AccuCheck measures the actual print deposit position versus the target pad to determine a measured print offset. It is an inexpensive, reliable method of obtaining machine quality and process capability information to ensure repeatable results and optimum printing performance.

Dispense for standard cartridges or choose the new patent-pending jar dispenser. Paste is released in precise, measured amounts across the stencil in a clean, uniform bead. Deposition volumes, frequency and placement are user programmable.

Auotmatic Paste Dispenser - Brochure

Easy to learn and use for the average operator, MPM’s Benchmark software is powerful yet intuitive, and facilitates rapid setup, assists with operational tasks, and makes changeover quick and easy. The software has been upgraded to Windows 10 and new production tools and new Quickstart programming to make it even easier to use.

The BridgeVision™ system is a patented method of analyzing bridge defects on circuit boards during the post-print inspection process.

This innovative system uses  texture-based image acquisition algorithms and a digital camera system with telecentric lenses to support the accurate identification of paste deposit defects.

• Finds bridging defects post-print – before they go to reflow
• Patented contrast and texture-based technologies
• Combines with SPC tools

The BridgeVision system operates simultaneously with the MPM 2D paste inspection system.

MPM’s patented printe rbased Vision and Inspection system is a cost-effective way to verify print and paste deposit results. It is flexible enough to handle the complete range of today’s most challenging components. This system measures the amount of paste covering the target pad and compares it with the required coverage. 2D inspection is integrated directly into the stencil printer to provide an immediate source of data.

MPM’s OpenApps is an open architecture source code which provides the capability of developing custom interfaces in support of Industry 4.0 initiatives and communication with Manufacturing Execution Systems (MES). ITW EAE is the first SMT company to offer open software architecture.

The Paste Height Monitor is designed to prevent defects caused y inadequate volumes of paste on the stencil. It combines advanced software and sensor technology to accurately monitor the paste bead for volume consistency. Upper and lower limit roll-height monitoring eliminates insufficient or excess paste volumes. It is a non-contact solution that can automatically add more paste to the stencil as it is needed.

Paste Height Monitor - Brochure

Temperature monitoring ensures proper paste viscosity to avoid bridging and voiding. MPM patent- pending paste temperature monitor allows paste to be measured in the cartridge or on the stencil.

Paste Temperature Monitor - Brochure

PrinTrack™ adds traceability, data harvesting and reporting to your printing process. It can seamlessly integrate with other equipment and elements in the manufacturing cycle, such as MES and ERP, and can be expanded factory-wide.

PrintTrack - Brochure & FAQs

RapidClean is a high-speed under-stencil cleaning system offered on MPM Momentum series printers. RapidClean is the fastest stencil cleaning solution available.

RapidClean - Brochure

The StencilVision™ system uses texture-based technology and a digital camera system to check the underside of a stencil for solder paste contamination. The results of the check drive wiper operation.

The StencilVision system:

• Detects solder paste seepage from apertures to stencil underside
• Initiates underside stencil wiping sequence to remove contamination
• Prevents print defects, contamination of PCB caused by dirty stencil underside
• Efficient – initiates wiping only when needed

Ensures optimum stencil to board gasketing

SPI Print Optimizer brings your Solder Paste Inspection (SPI) machine into communication with your MPM printer through a specially-developed common interface. When the SPI machine ‘sees’ X, Y and theta offset problems on a just-printed PCB, it analyzes the data virtually instantly and gives the printer instructions to correct those offsets, automatically, and ‘on the fly’.

SPI Print Optimizer - Brochure

AccuCheck Print Capability Verification allows the printer to measure its own print capability. Users can verify the machine’s capability at any time or continuously on their own products. AccuCheck measures the actual print deposit position versus the target pad to determine a measured print offset. It is an inexpensive, reliable method of obtaining machine quality and process capability information to ensure repeatable results and optimum printing performance.

Dispense for standard cartridges or choose the new patent-pending jar dispenser. Paste is released in precise, measured amounts across the stencil in a clean, uniform bead. Deposition volumes, frequency and placement are user programmable.

Auotmatic Paste Dispenser - Brochure

Automatic Pin Placement is a patented MPM tooling solution that uses the vision gantry to precisely place and remove pins. Pin patterns are software programmable and ensure quick, easy, and repeatable product changeover.

Easy to learn and use for the average operator, MPM’s Benchmark software is powerful yet intuitive, and facilitates rapid setup, assists with operational tasks, and makes changeover quick and easy. The software has been upgraded to Windows 10 and new production tools and new Quickstart programming to make it even easier to use.

The BridgeVision™ system is a patented method of analyzing bridge defects on circuit boards during the post-print inspection process.

This innovative system uses  texture-based image acquisition algorithms and a digital camera system with telecentric lenses to support the accurate identification of paste deposit defects.

• Finds bridging defects post-print – before they go to reflow
• Patented contrast and texture-based technologies
• Combines with SPC tools

The BridgeVision system operates simultaneously with the MPM 2D paste inspection system.

Only ITW EAE, with industry-leading core competencies in printer AND dispenser technologies, can bring both together to the customer’s advantage. Camalot Inside consists of two dispense pumps integrated into one printing machine. Camalot Inside provides ultimate flexibility, allowing the dispensing of two different materials, or the same material (doubling dispense throughput speed) with two needle sizes to easily administer multiple dot sizes.

Camalot Inside - Brochure & FAQ

Camalot Inside - Video

The EdgeLoc system uses a side snugging technique that removes the need for top clamps which interfere with the PCB to stencil contact. The result is optimal gasketing and more volumetrically consistent edge-to-edge prints. Choose the robust EdgeLoc II with side only clamping or EdgeLoc+ which can change between edge and top clamping;

EdgeLoc - Brochure

The MPM EnclosedFlow Print Head delivers uniform aperture filling and superb printing performance especially for fine pitch devices, with tremendous savings on solder paste over squeegee blade printing – in excess of 50% over blades for dramatically fast ROI. Printing fine features such as 01005s and 0.3mm pitch CSPs with up to 50% greater volume and 25% lower deviation than metal blades.

EnclosedFlow - Brochure & FAQ

MPM’s patented printe rbased Vision and Inspection system is a cost-effective way to verify print and paste deposit results. It is flexible enough to handle the complete range of today’s most challenging components. This system measures the amount of paste covering the target pad and compares it with the required coverage. 2D inspection is integrated directly into the stencil printer to provide an immediate source of data.

MPM’s OpenApps is an open architecture source code which provides the capability of developing custom interfaces in support of Industry 4.0 initiatives and communication with Manufacturing Execution Systems (MES). ITW EAE is the first SMT company to offer open software architecture.

Temperature monitoring ensures proper paste viscosity to avoid bridging and voiding. MPM patent- pending paste temperature monitor allows paste to be measured in the cartridge or on the stencil.

Paste Temperature Monitor - Brochure

The Paste Height Monitor is designed to prevent defects caused y inadequate volumes of paste on the stencil. It combines advanced software and sensor technology to accurately monitor the paste bead for volume consistency. Upper and lower limit roll-height monitoring eliminates insufficient or excess paste volumes. It is a non-contact solution that can automatically add more paste to the stencil as it is needed.

Paste Height Monitor - Brochure

PrinTrack™ adds traceability, data harvesting and reporting to your printing process. It can seamlessly integrate with other equipment and elements in the manufacturing cycle, such as MES and ERP, and can be expanded factory-wide.

PrinTrack - Brochure & FAQ

New quick release squeegee blades make changing blades quick and easy with no tools required.  It takes less than 30 seconds to change the blade.

RapidClean is a high speed stencil solvent cleaning innovation that slashes cycle time and improves stencil cleaning performance, especially for fine-pitch. RapidClean reduces 3 wipe strokes to 2 and cuts cycle time by 5 – 6 seconds per print cycle over the standard wiper; and because fewer cleaning cycles are required, RapidClean can save up to $10K USD per annum in paper savings per printer.

RapidClean - Brochure FAQ

Built on our patented optics technology, RapidView system delivers high-speed 2D inspection with device-level SPC reporting. RapidView inspection is up to three and half times faster than our standard system, can increase Field of View (FOE) 4x, and can work in conjunction with our GerberEZ Teach system.

SPI Print Optimizer brings your Solder Paste Inspection (SPI) machine into communication with your MPM printer through a specially-developed common interface. When the SPI machine ‘sees’ X, Y and theta offset problems on a just-printed PCB, it analyzes the data virtually instantly and gives the printer instructions to correct those offsets, automatically, and ‘on the fly’.

SPI Print Optimizer - Brochure

The StencilVision™ system uses texture-based technology and a digital camera system to check the underside of a stencil for solder paste contamination. The results of the check drive wiper operation.

The StencilVision system:

• Detects solder paste seepage from apertures to stencil underside
• Initiates underside stencil wiping sequence to remove contamination
• Prevents print defects, contamination of PCB caused by dirty stencil underside
• Efficient – initiates wiping only when needed

Ensures optimum stencil to board gasketing

AccuCheck Print Capability Verification allows the printer to measure its own print capability. Users can verify the machine’s capability at any time or continuously on their own products. AccuCheck measures the actual print deposit position versus the target pad to determine a measured print offset. It is an inexpensive, reliable method of obtaining machine quality and process capability information to ensure repeatable results and optimum printing performance.

Dispense for standard cartridges or choose the new patent-pending jar dispenser. Paste is released in precise, measured amounts across the stencil in a clean, uniform bead. Deposition volumes, frequency and placement are user programmable.

Auotmatic Paste Dispenser - Brochure

Automatic Pin Placement is a patented MPM tooling solution that uses the vision gantry to precisely place and remove pins. Pin patterns are software programmable and ensure quick, easy, and repeatable product changeover.

Easy to learn and use for the average operator, MPM’s Benchmark software is powerful yet intuitive, and facilitates rapid setup, assists with operational tasks, and makes changeover quick and easy. The software has been upgraded to Windows 10 and new production tools and new Quickstart programming to make it even easier to use.

The BridgeVision™ system is a patented method of analyzing bridge defects on circuit boards during the post-print inspection process.

This innovative system uses  texture-based image acquisition algorithms and a digital camera system with telecentric lenses to support the accurate identification of paste deposit defects.

• Finds bridging defects post-print – before they go to reflow
• Patented contrast and texture-based technologies
• Combines with SPC tools

The BridgeVision system operates simultaneously with the MPM 2D paste inspection system.

Only ITW EAE, with industry-leading core competencies in printer AND dispenser technologies, can bring both together to the customer’s advantage. Camalot Inside consists of two dispense pumps integrated into one printing machine. Camalot Inside provides ultimate flexibility, allowing the dispensing of two different materials, or the same material (doubling dispense throughput speed) with two needle sizes to easily administer multiple dot sizes.

Camalot Inside - Brochure & FAQ

Camalot Inside - Video

The EdgeLoc system uses a side snugging technique that removes the need for top clamps which interfere with the PCB to stencil contact. The result is optimal gasketing and more volumetrically consistent edge-to-edge prints. Choose the robust EdgeLoc II with side only clamping or EdgeLoc+ which can change between edge and top clamping;

EdgeLoc - Brochure

The EnclosedFlow print head offers significant process and cost advantages over printing with metal squeegee blades, particularly for fine-feature printing. Solder paste is held within an enclosed chamber, and is directly pressurized during the print stroke to provide uniform and complete aperture filling for the full range of aperture sizes and fill types.

The EnclosedFlow print head delivers superior volume/yield on fine pitch pads. Print fine pitch features such as 01005s and 0.3 mm pitch CSPs with up to 50% greater volume and 25% lower deviation that squeegee blades. The EnclosedFlow print head ensures optimal aperture filling for fine pitch devices and crisp uniform printing with less waste.

EnclosedFlow - Brochure and FAQs

MPM’s patented printe rbased Vision and Inspection system is a cost-effective way to verify print and paste deposit results. It is flexible enough to handle the complete range of today’s most challenging components. This system measures the amount of paste covering the target pad and compares it with the required coverage. 2D inspection is integrated directly into the stencil printer to provide an immediate source of data.

MPM’s OpenApps is an open architecture source code which provides the capability of developing custom interfaces in support of Industry 4.0 initiatives and communication with Manufacturing Execution Systems (MES). ITW EAE is the first SMT company to offer open software architecture.

The Paste Height Monitor is designed to prevent defects caused y inadequate volumes of paste on the stencil. It combines advanced software and sensor technology to accurately monitor the paste bead for volume consistency. Upper and lower limit roll-height monitoring eliminates insufficient or excess paste volumes. It is a non-contact solution that can automatically add more paste to the stencil as it is needed.

Paste Height Monitor - Brochure

Temperature monitoring ensures proper paste viscosity to avoid bridging and voiding. MPM patent- pending paste temperature monitor allows paste to be measured in the cartridge or on the stencil.

Paste Temperature Monitor - Brochure

The PrinTrack feature adds traceability, data harvesting, and reporting to your printing process. With PrinTrack, you always have an easy access to a comprehensive history, detailing:

• How your product was printed
• When it was printed
• The process parameters used to print the board
• All pertinent information that can be used to track products or troubleshoot the process if needed.

A flexible web reporting interface can be user-configured to produce traceability reports.

PrinTrack - Brochure & FAQ

New quick release squeegee blades make changing blades quick and easy with no tools required.  It takes less than 30 seconds to change the blade.

The RapidClean stencil cleaner is a high-speed stencil cleaning solution that improves cleaning performance and cuts cycle time. The RapidClean stencil cleaner provides precise wet/dry wipe transition and exceptional cleaning results with its paper over plenum design, venture vacuum, and patented roller solvent bar delivery system.

RapidClean - Brochure & FAQ

Built on our patented optics technology, RapidView system delivers high-speed 2D inspection with device-level SPC reporting. RapidView inspection is up to three and half times faster than our standard system, can increase Field of View (FOE) 4x, and can work in conjunction with our GerberEZ Teach system.

The SPI print optimizer communicates with the external Solder Paste Inspection (SPI) system to continuously monitor and auto-correct X, Y, and Theta registration ‘on the fly’ to stay on target and prevent print defects.

The StencilVision™ system uses texture-based technology and a digital camera system to check the underside of a stencil for solder paste contamination. The results of the check drive wiper operation.

The StencilVision system:

• Detects solder paste seepage from apertures to stencil underside
• Initiates underside stencil wiping sequence to remove contamination
• Prevents print defects, contamination of PCB caused by dirty stencil underside
• Efficient – initiates wiping only when needed

Ensures optimum stencil to board gasketing