Technical Papers

The use of high velocity, heated air to remove residual water has become the predominant method for drying printed circuit boards in the in-line aqueous…

Assemblers surveyed report that cleaning misprinted circuit assemblies is a production gap that has not been adequately addressed. Traditionally, the industry…

No-clean pastes have specific physical properties, which directly impact industry standard electronic assembly cleaning processes. This paper sets out to…

Cleaning electronic assemblies, or PCBs (Printed Circuit Boards), has been essential for many years. As PCB board density has increased and standoff height has…

As the electronics industry moves toward the implementation of Pb-free soldering, the impact on the assembly process must be considered. One process that is…

Moore’s Law infers that the number of transistors on a chip doubles approximately every two years. Consistent with Moore’s Law, high reliability electronic…

Most board assemblers strive to optimize their cleaning process to provide the best cleaning performance over a broad range of board assemblies. 

This…

Assemblers surveyed report that cleaning misprinted circuit assemblies is a production gap that has not been adequately addressed. Traditionally, the industry…